SOLDER PASTE 35

Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. The flow character- istics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.

• Excellent dispensing characteristics using 22 gage needles and Type 3 powder
• Manufactured and packaged void-free to insure the most consistent dispensibility available
• Capable of several thousands of dots per hour in high speed automated dispense equipment
• High activity on all substrates, including OSPs
• Stable tack over 8+ hours
• Available with lead-free alloys
• Compatible with Kester Easy Profile 256 stenciling solderpaste
• Classified as ROL0 per J-STD-004
• Compliant to Bellcore GR-78

Datasheet Download